ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high integration and high precision integrated circuits, and related assembly and testing services. The company operates through Testing; Assembly; Testing and Assembly for Liquid Crystal Display and Other Flat-Panel Display Driver Semiconductors; and Bumping segments. It provides a range of back-end assembly and test services, including engineering test, wafer probing and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other flat-panel display driver semiconductors. The company's semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. It serves customers in Taiwan, Japan, Singapore, and internationally. The company was founded in 1997 and is headquartered in Hsinchu, Taiwan.
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