Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. The company offers turnkey packaging and test services, including semiconductor wafer bumps, wafer probes, wafer back-grinds, package design, packaging, and test and drop shipment services. Its packages employ wirebond, flip chip, and copper clip and other interconnect technologies. The company also provides semiconductor testing services, such as wafer testing or probe, and final test services; flip chip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; flip chip ball grid array (BGA) products for various networking, storage, computing, and consumer applications; and flip chip molded BGA packages. In addition, it offers leadframe packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electro-mechanical devices; and system-in-package modules, which are used in radio frequency and front end modules, baseband processing, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. The company primarily serves integrated device manufacturers, fabless semiconductor companies, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
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